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Why scalp processors? Why doesn't Intel install good thermal paste right away?
I heard that when scalping the Intel Core i7 6700K and replacing the thermal paste with liquid metal (or something like that), the temperature drops by 20C.
If this creates such a good result, why doesn't Intel immediately use this liquid metal in their processors?
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A long time ago, in a galaxy far, far away...
Hmm, no, in this galaxy. And not so long ago, in the 199s, early 200s, processors were supplied without a cover at all, the cooler was installed directly on the CPU chip. But it happened that the crystal was damaged by inaccurate exposure. In addition, during these years there was a huge progress in CPU performance, but also a very noticeable increase in energy consumption, which led to an increase in the mass of the cooler and an increased risk of damaging the chip.
As a result (I don’t remember who was the first), they began to cover the crystal with a heat-distributing (and at the same time protective) cover. At the same time, this cover began to be removed for overclocking. Because an extra intermediary slightly worsens the thermal conductivity. In addition, there were cases of not quite defective, a curved (convex or concave) cover, the cooler was not pressed tightly, which worsened cooling. It happened that the lid itself was unevenly soldered (and in those days it was solder that was used) and the core was heated more than classmates. Sometimes the cover was removed and not put back at all. Sometimes they took it off, changed the thermal interface and put the lid back on. The thing is risky (the solder is very strong, it's easy to damage the crystal), it gave only a few degrees of gain, so it's not very popular.
A few years ago, Intel went nuts from the lack of competition and no longer uses solder between the cap and the die. First, in cheap CPUs, starting with Ivy Bridge LGA1155 (yes, if you didn't know the position of Intel: 6700K is a cheap processor. Not cheap - it's $1000 and up). Now, even in the younger representatives of the enthusiast line (LGA 2011-3), thermal paste is used instead of solder. I'm not sure about server xeons, but most likely there is still solder holding on there.
Why uses? Thermal paste is corny cheaper than solder, and much cheaper than liquid metal. For one person who expressed dissatisfaction with the new policy, there is an army of those who did not notice anything. The first was simply neglected.
Saboteur _
Show your competitor. AMD Zen - we hope, we are waiting. The current line is not a competitor for the performance segment.
In the meantime, there is no competitor - you can reduce production costs. Everything is natural.
May be planned obsolescence.
For the same reason, they do not make durable light bulbs, good roads, and so on.
It's a pity, but SB processors used liquid metal.
It is not profitable for anyone to make a high-quality and durable product, but solder does not "dry out" unlike thermal paste ...
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