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Can STM32H753VI (TFBGA100) be strea- sized in 4 layers?
All pins need to be removed.
One of the layers is the earth plane.
The thickness of the outer layer is 35 microns.
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Theoretically possible. 2 outer layers are signal, 2 inner layers are power and GND.
Dilute the two outer rows of balls on the Top layer, the next two rows - on the Bottom, the inner balls - ground and power. It all depends on whether the technical standards of your PP production allow you to drag a track between the pads on a 35 micron foil.
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